3D and Circuit Integration of MEMS

3D and Circuit Integration of MEMS

Author: Masayoshi Esashi

Publisher: John Wiley & Sons

ISBN: 9783527823246

Category: Technology & Engineering

Page: 528

View: 585

Download Now
3D and Circuit Integration of MEMS Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
3D and Circuit Integration of MEMS
Language: en
Pages: 528
Authors: Masayoshi Esashi
Categories: Technology & Engineering
Type: BOOK - Published: 2021-04-26 - Publisher: John Wiley & Sons

3D and Circuit Integration of MEMS Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr.
3D and Circuit Integration of MEMS
Language: en
Pages: 528
Authors: Masayoshi Esashi
Categories: Technology & Engineering
Type: BOOK - Published: 2021-04-06 - Publisher: John Wiley & Sons

3D and Circuit Integration of MEMS Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr.
Microelectronic Applications of Chemical Mechanical Planarization
Language: en
Pages: 760
Authors: Yuzhuo Li
Categories: Technology & Engineering
Type: BOOK - Published: 2007-10-19 - Publisher: John Wiley & Sons

An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer
Silicon Optoelectronic Integrated Circuits
Language: en
Pages: 441
Authors: Horst Zimmermann
Categories: Science
Type: BOOK - Published: 2019-01-30 - Publisher: Springer

Explains the circuit design of silicon optoelectronic integrated circuits (OEICs), which are central to advances in wireless and wired telecommunications. The essential features of optical absorption are summarized, as is the device physics of photodetectors and their integration in modern bipolar, CMOS, and BiCMOS technologies. This information provides the basis
Nano-Semiconductors
Language: en
Pages: 599
Authors: Krzysztof Iniewski
Categories: Technology & Engineering
Type: BOOK - Published: 2018-09-03 - Publisher: CRC Press

With contributions from top international experts from both industry and academia, Nano-Semiconductors: Devices and Technology is a must-read for anyone with a serious interest in future nanofabrication technologies. Taking into account the semiconductor industry’s transition from standard CMOS silicon to novel device structures—including carbon nanotubes (CNT), graphene, quantum dots, and