3D Integration for VLSI Systems

3D Integration for VLSI Systems

Author: Chuan Seng Tan

Publisher: CRC Press

ISBN: 9789814303828

Category: Science

Page: 350

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Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV. There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.
3D Integration for VLSI Systems
Language: en
Pages: 350
Authors: Chuan Seng Tan, Kuan-Neng Chen, Steven J. Koester
Categories: Science
Type: BOOK - Published: 2016-04-19 - Publisher: CRC Press

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC
3D Integration for VLSI Systems
Language: en
Pages: 350
Authors: Chuan Seng Tan, Kuan-Neng Chen, Steven J. Koester
Categories: Science
Type: BOOK - Published: 2011-09-26 - Publisher: Pan Stanford Publishing

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC
Physical Design for 3D Integrated Circuits
Language: en
Pages: 397
Authors: Aida Todri-Sanial, Chuan Seng Tan
Categories: Technology & Engineering
Type: BOOK - Published: 2017-12-19 - Publisher: CRC Press

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits,
3D Integration in VLSI Circuits
Language: en
Pages: 219
Authors: Katsuyuki Sakuma
Categories: Technology & Engineering
Type: BOOK - Published: 2018-04-17 - Publisher: CRC Press

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges
Handbook of 3D Integration, Volume 4
Language: en
Pages: 265
Authors: Paul D. Franzon, Erik Jan Marinissen, Muhannad S. Bakir
Categories: Technology & Engineering
Type: BOOK - Published: 2019-01-25 - Publisher: John Wiley & Sons

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the