A Guide to Lead-free Solders

A Guide to Lead-free Solders

Author: John W. Evans

Publisher: Springer Science & Business Media

ISBN: 9781846283109

Category: Technology & Engineering

Page: 206

View: 927

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The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.
A Guide to Lead-free Solders
Language: en
Pages: 206
Authors: John W. Evans
Categories: Technology & Engineering
Type: BOOK - Published: 2007-01-05 - Publisher: Springer Science & Business Media

The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them
Lead-Free Soldering
Language: en
Pages: 299
Authors: Jasbir Bath
Categories: Technology & Engineering
Type: BOOK - Published: 2007-06-26 - Publisher: Springer Science & Business Media

The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including
Fundamentals of Lead-Free Solder Interconnect Technology
Language: en
Pages: 253
Authors: Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
Categories: Technology & Engineering
Type: BOOK - Published: 2014-11-05 - Publisher: Springer

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in
Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Language: en
Pages: 1048
Authors: Karl J. Puttlitz, Kathleen A. Stalter
Categories: Technology & Engineering
Type: BOOK - Published: 2004-02-27 - Publisher: CRC Press

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Language: en
Pages: 143
Authors: Qingke Zhang
Categories: Science
Type: BOOK - Published: 2015-10-31 - Publisher: Springer

This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC