Advances in Cryogenic Engineering Materials

Advances in Cryogenic Engineering Materials

Author: K.D. Timmerhaus

Publisher: Springer

ISBN: 1461398738

Category: Science

Page: 1120

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The Sixth International Cryogenic Materials Conference (ICMC) was held on the campus of Massachusetts Institute of Technology in Cambridge in col laboration with the Cryogenic Engineering Conference (CEC) on August 12-16, 1985. The complementary program and the interdependence of these two dis ciplines foster the conference. Its manifest purpose is sharing the latest advances in low temperature materials science and technology. Equally im portant, areas of needed research are identified, prioriti-es for new research are set, and an increased appreciation of interdisciplinary, interlaboratory, and international cooperation ensues. The success of the conference is the result of the. able leadership and hard work of many people: S. Foner of M.I.T. coordinated ICMC efforts as its Conference Chairman. A. I. Braginski of Westinghouse R&D Center planned the program with the assistance of Cochairmen E. N. C. Dalder of Lawrence Livermore National Laboratory, T. P. Orlando of M.I.T., D. O. Welch of Brookhaven National Laboratory, and numerous other committee members. A. M. Dawson of M.I.T., Chairman of Local Arrangements, and G. M. Fitzgerald, Chairman of Special Events, skillfully managed the joint conference. The contributions of the CEC Board, and particularly its conference chairman, J. L. Smith, Jr. of M.I.T., to the organization of the joint conference are also gratefully acknm.ledged.
Advances in Cryogenic Engineering Materials
Language: en
Pages: 1120
Authors: K.D. Timmerhaus, R.W. Fast, A.F. Clark, R.P. Reed
Categories: Science
Type: BOOK - Published: 2013-02-20 - Publisher: Springer

The Sixth International Cryogenic Materials Conference (ICMC) was held on the campus of Massachusetts Institute of Technology in Cambridge in col laboration with the Cryogenic Engineering Conference (CEC) on August 12-16, 1985. The complementary program and the interdependence of these two dis ciplines foster the conference. Its manifest purpose is
Advances in Cryogenic Engineering Materials
Language: en
Pages: 924
Authors: R.W. Fast, R.P. Reed
Categories: Technology & Engineering
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

The Fourth International Cryogenic Materials Conference (ICMC) was held in San Diego, California in conjunction with the Cryogenic Engineer ing Conference (CEC) on August 10-l4, 1981. The synergism produced by conducting the two conferences together remains very strong. In the ap pl1cation of cryogenic technology, materials continue to be a
Advances in Cryogenic Engineering Materials
Language: en
Pages: 998
Authors: A. F. Clark
Categories: Science
Type: BOOK - Published: 2013-01-19 - Publisher: Springer

The Fifth International Cryogenic Materials Conference (ICMC) was held in Colorado Springs, Colorado in collaboration with the Cryogenic Engineering Conference (CEC) on August 15-19, 1983. The growth and success of the joint conferences is a result of their complementary program and close cooperation. Materials remain a challenge in the application
Advances in Cryogenic Engineering Materials
Language: en
Pages: 768
Authors: R.W. Fast, F.R. Fickett
Categories: Technology & Engineering
Type: BOOK - Published: 2012-11-29 - Publisher: Springer

Books about Advances in Cryogenic Engineering Materials
Advances in Cryogenic Engineering Materials
Language: en
Pages: 584
Authors: U. Balachandran, Kathleen Amm, David Evans, Eric Gregory, Mike Osofsky, Sastry Pamidi, Chan Park, Judy Wu, Mike Sumption
Categories: Technology & Engineering
Type: BOOK - Published: 2008-04-04 - Publisher: American Institute of Physics

All papers have been peer-reviewed. The 2007 joint Cryogenic Engineering Conference and International Cryogenic Materials Conference (CEC-ICMC) was held at the Chattanooga Convention Center in Chattanooga, TN, from July 16th through 20th. Nearly 700 attendees from 28 countries came together to enjoy the joint technical programs, industrial exhibit, and special