Search Results for: Emc And The Printed Circuit Board
EMC and the Printed Circuit Board
Author: Mark I. Montrose
Publisher: John Wiley & Sons
ISBN: 9780471660903
Category: Science
Page: 344
View: 181
Download NowLanguage: en
Pages: 344
Pages: 344
This accessible, new reference work shows how and why RF energy iscreated within a printed circuit board and the manner in whichpropagation occurs. With lucid explanations, this book enablesengineers to grasp both the fundamentals of EMC theory and signalintegrity and the mitigation process needed to prevent an EMCevent. Author Montrose
Language: en
Pages: 238
Pages: 238
Presents simple techniques for designing and laying out circuits that meet the most stringent domestic and international regulations on electromagnetic compatibility for high technology products. Includes sample designs in every stage of the product development cycle, information on the latest suppression techniques, and a checklist of layout techniques. Annotation copyrighted
Language: en
Pages: 370
Pages: 370
This book simplifies the complex field of electromagnetic compatibility into easy concepts without the need for complicated math or extensive computational analysis. Learn how to design printed circuit boards and systems quickly with just five easy equations. Electromagnetic compatibility requirements are easily achieved with the author's unique approach by transforming
Language: en
Pages: 322
Pages: 322
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is
Language: en
Pages: 640
Pages: 640
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging