Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Author: Xing-Chang Wei

Publisher: CRC Press

ISBN: 9781315305868

Category: Computers

Page: 322

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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Language: en
Pages: 322
Authors: Xing-Chang Wei
Categories: Computers
Type: BOOK - Published: 2017-09-19 - Publisher: CRC Press

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Language: en
Pages: 322
Authors: Xing-Chang Wei
Categories: Computers
Type: BOOK - Published: 2017-09-19 - Publisher: CRC Press

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is
Signal Integrity and Radiated Emission of High-Speed Digital Systems
Language: en
Pages: 552
Authors: Spartaco Caniggia, Francescaromana Maradei
Categories: Science
Type: BOOK - Published: 2008-11-20 - Publisher: John Wiley & Sons

Before putting digital systems for information technology or telecommunication applications on the market, an essential requirement is to perform tests in order to comply with the limits of radiated emission imposed by the standards. This book provides an investigation into signal integrity (SI) and electromagnetic interference (EMI) problems. Topics such
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Language: en
Pages: 742
Authors: Inna P. Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman
Categories: Technology & Engineering
Type: BOOK - Published: 2016-04-26 - Publisher: Springer

This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models
EMC and the Printed Circuit Board
Language: en
Pages: 344
Authors: Mark I. Montrose
Categories: Science
Type: BOOK - Published: 2004-04-05 - Publisher: John Wiley & Sons

This accessible, new reference work shows how and why RF energy iscreated within a printed circuit board and the manner in whichpropagation occurs. With lucid explanations, this book enablesengineers to grasp both the fundamentals of EMC theory and signalintegrity and the mitigation process needed to prevent an EMCevent. Author Montrose